Job Details

Job Description

Are you passionate about pushing the boundaries of Silicon Photonics package design? We're seeking a talented and driven Photonics Hybrid Integration Engineer to lead the development of next-generation Silicon Photonics solutions. In this role, you'll be at the forefront of innovation, collaborating with cross-functional teams to optimize the hybrid/heterogeneous integration of exotic materials into a Silicon Photonics platform and ensure seamless transition to mass production. If you're eager to own the design and development of hybrid/heterogeneous integration and W2W/D2W bonding, while staying abreast of cutting-edge technologies, we encourage you to apply!

Responsibilities

As a Photonics Hybrid Integration Engineer, you will be a key technical leader driving the development, optimization, and scaling of fabrication processes for an advanced heterogeneously integrated silicon-photonics platform. You will take ownership of advanced process node development, lead root-cause investigations, guide continuous improvement, and work cross-functionally to enable reliable high-volume manufacturing. Your responsibilities will include (but not limited to):

• Explore, define, and optimize next-generation wafer- and package-level fabrication processes for a high-performance Silicon photonics platforms, including hybrid/heterogeneous integration of exotic materials, using advanced packaging technologies.
• Lead the next generation hybrid silicon photonic design in collaboration with cross-functional teams, stakeholders and vendors to ensure package and performance requirements are met.
• Survey advanced Photonic solutions, materials and vendors to stay current with new technological advancements.
• Own and maintain the process and the manufacturing documentation, along with Bill of Materials for new products.
• Drive package debug activities during product validation and qualification.
• Conduct root cause analysis and implement solutions to achieve high yield targets.
• Support the development activities at our Contract Manufacturers, both remotely and on-site to ensure a smooth transition to mass production.

Qualifications

Skills and experience to have

• 3-5 years of experience in integrated photonics, semiconductors, or microelectronics fabrication.
• Expertise in Silicon photonics, TFLN, BTO, etc...
• Experience with wafer fab manufacturing processes, such as lithography, PVD/CVD/ALD, wet/dry etch, CMP.
• Experience with W2W and D2W bonding.
• Track record in developing and optimizing new nanofabrication processes.
• Strong problem-solving skills and ability to analyze complex data sets.
• Experience with documentation of fabrication, inspection, and assembly processes.
• Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively.
• Experience with package and process design/development from design to production.
• Experience with metrology techniques such as SEM/XSEM, confocal microscopy, acoustic imaging, AFM, RI characterization.

It would be nice if you also had

• Expertise with advanced packaging (3D, 2.5D) technologies.
• Experience with RF/high-speed electronics and signal integrity
• Experience in microelectronics, optoelectronics packaging design and assembly.
• Familiar with flip chip, BGA, PCBA, Flex design reliability and processing.
• Experience interfacing with wafer fabs and OSATs

About Us

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we're advancing connectivity to secure a brighter world.

Learn more about life at Nokia.

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you're interested in this role but don't meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

About the Team

Some of our benefits in US:

• Corporate Retirement Savings Plan
• Health and dental benefits
• Short-term disability, and long-term disability
• Life insurance, and AD&D - Company paid 2x base pay
• Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
• Paid time off for holidays and Vacation
• Employee Stock Purchase Plan
• Tuition Assistance Plan
• Adoption assistance
• Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.

Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.